Cleaning & Surface Preparation
We have applied Schlötter technology and innovation to the performance critical processes of surface preparation.
Whatever you do next must be built on a clean, reliable and appropriate foundation, especially for the increasing demands of electronics manufacturing related to AI, 5G and IoT and other future technologies, including SAP and mSAP.
Schlotter have a range of processes for ideal surface prep, including;
- Cleaner SLOTOCLEAN S20
- Microetch SLOTETCH Cu2670 or SLOTOETCH 584
Cleaner SLOTOCLEAN S20
- Low surface tension (<30 mN/m)
- Accepted globally as a fundamental ‘go to’ cleaner for clean surfaces and reliability.
- Single component, easy to operate and cost effective.
- Low temperature operation, compatibility with SM and DF technology.
- Rinses clean to provide a clean copper surface for plating or microetching.
- High contamination capacity.
Microetch SLOTETCH Cu2670 or SLOTOETCH 584
- High capacity
Adaptable to suit technology
- Smoother copper to avoid micro-entrapment during immersion deposition
- Surface preparation for Dry Film adhesion
Microetch
SLOTETCH
Cu2670
