Copper & Tin Plating Systems
DC Copper Plating
- Wide operating windows – enabling continued production when faced with challenging conditions.
- Low maintenance – NO downtime required for solution purification
- Single additive replenishment
- Very easy to control and maintain
- Consistent deposit properties. Typically >18% ductility.
Pulse Plating
A range of Pulse Plating processes to match any exacting requirements. High Aspect Ratio and consistent microvia plating can be achieved with ease.
Schlotter were the first supplier to develop and install a fully functional Pulse Plate Additive System in the UK. We continue to work with customers globally at the leading edge of technology.
- Copper SLOTOCOUP BV 110 retains the same DC benefits of Copper SLOTOCOUP Cu 120 Plating, with the added performances related to pulse plate technology.
- Copper SLOTOCOUP PRT2200 is an advanced, inert anode process with extremely high throwing power, ideal for HAR demands in Telecommunication and 5G.
Micro-Via Filling
Schlotter are leaders in the field of via-filling technology. Bright Copper SLOTOCOUP BV 110 and Copper SLOTOCOUP SF50 are market leaders in terms of process capability and presence in the market.
Capable of meeting highest demands and challenges in electronics manufacturing.
Tin Plate, Tin-Lead Plate
As an etch resist or as a final finish, our Matt Tin SAT 20-1 and Tin Lead SLOTOLET K 10-1 processes are stable and robust, extremely easy to operate and maintain, and have a long pedigree in the market.
The first Schlotter Tin plate process was patented in 1918, and we’ve been growing that expertise ever since.