ENIG &
ENEPIG
Schloetter have achieved benchmark systems, utilising our global experience in PCB and Electronics, and combining with the innovation for which we have become renowned.
Each component in our system is designed to work in harmony within the complete process, to achieve a truly effective and functional Final Finish.
ENIG
- Cleaner SLOTOCLEAN S20
- Microetch SLOTETCH Cu2670 or SLOTOETCH 584
Schloetter has delivered the answers that the market demands;
Consistency – across the panel, plated features, and solution life;
- Deposit thickness
- Phosphorous content of the Nickel Deposit
- Stability
Predictability
- Confidence to schedule-in productivity
Ease of control
- Simple and easy to operate
Performance
- Excellent solderability on accelerated aging
- Excellent for aluminium wire bonding
- No nickel ‘hyper-corrosion’
- No nickel foot or stray plating
- Excellent Shear testing results
Cleaner Additive to prevent Plating on Tooling Holes
- No additional process steps required – extremely effective
Compatibility with Nickel Controllers
ENIG
Providing reliable Gold Wire Bonding.
The SLOTONIG NG 5060 Electroless Palladium provides exceptional solderability and wire bondability to expand the ENIG capability with Gold Wire Bonding.